| ① 立体图 | ||||
 |
 |
|||
| ② 三视图 | ||||
|
|
|
|||
| Top View | Side View | |||
|
|
 |
|||
| Bottom View | Bonding Pad | |||
| ① 立体图 | ||||||||
|
|
|||||||
| ② 三视图 | ||||||||
|
|
|
 |
|
|||||
| Top View | Side View | Bottom View | Bonding Pad |
RGB内置IC 1010系列
| 参数 | 符号 | 范围 | 单位 | 条件 | |||||
|---|---|---|---|---|---|---|---|---|---|
| R | G | B | R | G | B | ||||
| 最大额定值 | 操作温度 | Topr | 23 | 23 | 23 | °C | - | ||
| 存储温度 | Tstg | -40~+85 | -40~+85 | -40~+85 | °C | - | |||
| CSP结温 | Tj | ≤110 | ≤125 | ≤1 | °C | - | |||
| 正向电流 | IF | ≤20 | ≤40 | ≤40 | mA | - | |||
| 封装工艺温度 | - | <280 | <280 | <280 | °C | - | |||
| - | <10 | <10 | <10 | s | - | ||||
| ESD | - | 1.5 | 2 | 2 | kV | HBM | |||
| 光电特性 | 反向电流 | lr | <1 | <1 | <1 | μA | Vr=-25V | Vr=-10V | Vr=-10V |
| 正向电压 | VF | 2.0~2.1 | 2.5~2.6 | 2.7~2.8 | V | IF=10mA | IF=10mA | IF=10mA | |
| 亮度 | lv | 330~360 | 750~900 | 160~200 | mcd | IF=10mA | IF=10mA | IF=10mA | |
| 主波长 | Wd | 622.5~625 | 522.5~525 | 467.5~470 | nm | IF=10mA | IF=10mA | IF=10mA | |