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| Bottom View | Bonding Pad | |||
| ① Stereogram | ||||||||
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| Top View | Side View | Bottom View | Bonding Pad |
CSP1919 series
| Parameters | Symbol | Range | Unit | Condition | |
|---|---|---|---|---|---|
| Maximum rated value | Operating temperature | Topr | <110 | °C | - |
| Storage temperature | Tstg | - 40 ~ + 85 | °C | - | |
| CSP junction temperature | Tj | ≤150 | °C | - | |
| Forward current | IF | ≤1500 | mA | - | |
| Packaging process temperature | - | <280 | °C | - | |
| - | <10 | s | - | ||
| ESD | - | >2 | kV | HBM | |
| Photoelectric characteristics | Reverse current | lr | <1 | Mu A | Vr= -8V |
| Forward voltage | VF | 2.9 ~ 3.1 |
V | IF=600mA |
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| Luminous flux | Ф e |
270-310 |
lm | IF=600mA |
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| Color temperature | Tc | 6000 ~ 7500 | k | IF=600mA |
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| Color rendering index | Ra | >70 | - | IF=600mA |