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| Top View | Side View | |||
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| Bottom View | Bonding Pad | |||
| ① Stereogram | ||||||||
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| Top View | Side View | Bottom View | Bonding Pad |
CSP 1313 series
| Parameters | Symbol | Range | Unit | Condition | |
|---|---|---|---|---|---|
| Maximum rated value | Operating temperature | Topr | - 40 ~ + 85 | °C | - |
| Storage temperature | Tstg | - 20 ~ + 65 | °C | - | |
| CSP junction temperature | Tj | ≤150 | °C | - | |
| Forward current | IF | ≤700 | mA | - | |
| Packaging process temperature | - | <280 | °C | - | |
| - | <10 | s | - | ||
| ESD | - | >2 | kV | HBM | |
| Photoelectric characteristics | Reverse current | lr | <1 | Mu A | Vr= -7V |
| Forward voltage | VF | 2.7 ~ 2.9 |
V | IF=350mA |
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| Luminous flux | Ф e |
100-120 |
lm | IF=350mA |
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| Color block | - | L01-K03 | - | IF=350mA |