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| Bottom View | Bonding Pad | |||
| ① Stereogram | ||||||||
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| Top View | Side View | Bottom View | Bonding Pad |
CSP 1005 series
| Parameters | Symbol | Range | Unit | Condition | |
|---|---|---|---|---|---|
| Maximum rated value | Operating temperature | Topr | <110 | °C | - |
| Storage temperature | Tstg | - 40 ~ + 85 | °C | - | |
| CSP junction temperature | Tj | ≤125 | °C | - | |
| Forward current | IF | ≤250 | mA | - | |
| Packaging process temperature | - | <300 | °C | - | |
| - | <10 | s | - | ||
| ESD | - | >1 | kV | HBM | |
| Photoelectric characteristics | Reverse current | lr | <1 | Mu A | Vr= -7V |
| Forward voltage | VF | 2.7 ~ 2.9 |
V | IF=20mA |
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| Luminous flux | Ф e |
4-7 |
lm | IF=20mA |
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| Color temperature | Tc | 4000 ~ 6000 | k | IF=20mA |
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| Color rendering index | Ra | >95 | - | IF=20mA |